Spherical Silver Clad Copper Powder Description
Spherical Silver Clad Copper Powder is a type of composite powder consisting of a core of copper surrounded by a thin layer of silver. It features good high-temperature resistance and chemical corrosion resistance. It can be used as highly conductive thermal conductive fillers and electromagnetic wave shielding materials in various polymer materials. The small particle size of silver-coated copper powder can be used to configure highly conductive ink to print circuit board circuits. Silver-coated copper powder can be added to ceramics and other metal powder materials to improve the electrical and thermal conductivity of composite materials.
Spherical Silver Clad Copper Powder Specification
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Average Particle Size
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1-3 μm
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D50
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1μm
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Purity (%)
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>99.9
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Silver Content (%)
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20/10
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Specific Surface Area (m2/g)
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0.9
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Bulk Density (g/cm3)
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2.2
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Tap Density (g/cm3)
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3.4
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Spherical Silver Clad Copper Powder Applications
- Printed circuit board (PCB)
- Conductive adhesive
- Touch screen sensor
- EMI shielding
- Conductive tape
- Conductive ink
Spherical Silver Clad Copper Powder Packaging
Our Spherical Silver Clad Copper Powder is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
