Copper powder Description
This fine copper particulate is typically produced from pure copper materials and plays a crucial role in the electronics industry. It is utilized in the manufacture of circuit boards, conductive adhesives, brushes, conductive coatings, pigments, and more. Additionally, at the nanoscale, these particles serve as catalysts, lubricants, and are applied in various other fields.
The characteristics of these copper-based particles are closely tied to their size. As the dimensions decrease, their performance undergoes significant changes. Specifically, nano-sized elements with a distribution ranging from 1 to 100 nanometers exhibit notable alterations in optical, electrical, magnetic, mechanical, and chemical properties.
Thanks to these exceptional traits, nano-scale copper materials have found extensive applications in high-energy catalysts, lubricant additives, conductive substances, and materials that require enhanced toughness.
Color of Copper powder
Different types of copper powder exhibit various colors. For instance, particles around 20 nanometers appear black, those at 100 nanometers show a reddish-brown hue, and 500-nanometer particles exhibit a light rose-red shade. Flake-shaped variants present a copper-red metallic appearance with a shiny metallic luster.
Main Products
| Type |
Purity |
Shape |
Particle Size |
| Copper Powder |
99.90% |
Spherical |
50nm,300nm,1um or customized |
| 99.90% |
Nearly spherical |
1000μm |
| 99.90% |
Nearly spherical |
80nm |
| Electrolytic Copper Powder |
99.90% |
|
1-5μm; 6-12μm; 12-15μm; customized |
| Copper Powder for Diamond Tools |
99.50% |
Non-Spherical |
75μm; 53μm; 45μm; customizable |
| Copper Powder for Thermal Spraying |
99-99.95% |
Spherical |
-75 +31 µm; -90 +38 µm |
| Copper Chromium Nanopowder |
99.90% |
|
40-80nm |
| Copper Zinc Alloy Powder |
>99.5 % |
|
60 nm |
| Copper Tungsten Alloy Powder |
>99.6 % |
|
-80+200 mesh |
| Copper Nickel Alloy Powder |
>99.7% |
Spherical |
55nm |
| Holmium Copper Alloy Powder |
99.0%-99.98% |
Non-Spherical |
-100-325 mesh |
| Copper Zirconium Powder |
99.90% |
Non-Spherical |
<40μm |
| Silver Copper Alloy Nanopowder |
99.99% |
Non-Spherical |
20nm, 50nm, 80-100nm, etc |
Physical Properties of Copper Powder
|
Property
|
Value
|
|
Appearance
|
Purple-red metallic luster
|
|
Density
|
8.92 g/cm³
|
|
Melting Point
|
1083.4 ℃
|
|
Boiling Point
|
2567 ℃
|
|
Ductility
|
Excellent
|
|
Thermal and Electrical Conductivity
|
Good
|
|
Magnetism
|
Diamagnetic
|
|
Crystal Structure
|
Face-centered cubic
|
|
Electrical Resistivity
|
1.68 ×10−8 Ω·m
|
|
Young's Modulus
|
110－128 GPa
|
|
Shear Modulus
|
48 GPa
|
|
Poisson's Ratio
|
0.34
|
|
Mohs Hardness
|
3
|
|
Vickers Hardness
|
343 MPa~369 MPa
|
|
Brinell Hardness
|
235 MPa~878 MPa
|
|
Solid Density
|
8.960 g/cm³
|
|
Liquid Density (Molten)
|
8.920 g/cm³
|
|
Specific Heat Capacity
|
24.440 J/(mol·K)
|
|
Heat of Vaporization
|
300.4 kJ/mol
|
|
Heat of Fusion
|
13.26 kJ/mol
|
|
Thermal Conductivity
|
401 W/(m·K)
|
|
Thermal Expansion Coefficient (25 °C)
|
16.5 µm/(m·K)
|
|
Ionization Energy
|
7.726 eV
|
|
Flame Test
|
Green
|
|
Relative Atomic Mass
|
63.546
|
|
Critical Pressure
|
5 MPa
|
|
Critical Temperature
|
1726.85 ℃
|
|
Critical Volume
|
0.1 m³/kmol
|
|
Critical Compressibility Factor
|
0.2
|
Copper Powder Applications
Copper Powder is widely used in powder metallurgy, electrical carbon products, electronic materials, metal coatings, chemical catalysts, filters, heat dissipation pipes, and other electromechanical components, as well as in the electronics and aerospace industries.
High-purity copper powder is widely used due to the following key advantages:
- Excellent Electrical Conductivity: Copper is a metal with exceptionally high electrical conductivity. High-purity copper powder preserves and enhances this characteristic, making it a core raw material for the production of various conductive materials.
- Good Thermal Conductivity: Copper also boasts outstanding thermal conductivity. High-purity copper powder plays a significant role in the field of thermal management.
- High Purity and Low Impurities: High purity means extremely low levels of impurities, which is crucial for applications with stringent performance requirements, such as electronic materials and precision devices.
- Advantages of Powder Form: The powder form allows copper materials to be more easily processed through mixing, sintering, spraying, and other techniques, enabling the production of components or coatings with various shapes and functionalities.
