Silver Copper Alloy Nanopowder (AgCu) is a lead-free solder material for electrical interconnects and surface-mount technology assembly. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Silver Copper Alloy Nanopowder (AgCu).
Related products: Copper Alloy CuNi2SiCr Powder, Copper Alloy CuAlNiFe Powder, Silver Tin Alloy Nanopowder (AgSn)
Silver Copper Alloy Nanopowder (AgCu) is a lead-free solder material for electrical interconnects and surface-mount technology assembly. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Silver Copper Alloy Nanopowder (AgCu).
Related products: Copper Alloy CuNi2SiCr Powder, Copper Alloy CuAlNiFe Powder, Silver Tin Alloy Nanopowder (AgSn)
Silver Copper Alloy Nanopowder (AgCu) is a lead-free solder material for electrical interconnects and surface-mount technology assembly. It has good conductivity, low resistivity, high disperse and high stability.
Chemical Composition |
Ag, Cu |
APS |
20nm, 50nm, 80-100nm, etc. |
Morphology |
Nearly spherical |
Purity |
99.99% |
Silver Copper Alloy Nanopowder (AgCu) is applied to the conductive adhesive, electromagnetic shielding conductive paint, conductive rubber, conductive plastic, polymer slurry, conductive electrostatic paint, etc.
Our Silver Copper Alloy Nanopowder (AgCu) is carefully handled during storage and transportation to preserve the quality of our product in its original condition.