CrNiSiMoVAl High-Entropy Alloys (HEAs) Spherical Powder is a new type of alloy, which is very unique in performance. Stanford Advanced Materials (SAM) provides kinds of high-entropy alloys spherical powders like CrNiSiMoVAl for 3D printing application.
Related products: FeAlNiCrX High-Entropy Alloys Spherical Powder, CrWMoTi High-Entropy Alloys (HEAs) Spherical Powder, FeCoNiCuAl High-Entropy Alloys (HEAs) Spherical Powder, FeCrNiMoAl High-Entropy Alloys (HEAs) Spherical Powder
CrNiSiMoVAl High-Entropy Alloys (HEAs) Spherical Powder is a new type of alloy, which is very unique in performance. Stanford Advanced Materials (SAM) provides kinds of high-entropy alloys spherical powders like CrNiSiMoVAl for 3D printing application.
Related products: FeAlNiCrX High-Entropy Alloys Spherical Powder, CrWMoTi High-Entropy Alloys (HEAs) Spherical Powder, FeCoNiCuAl High-Entropy Alloys (HEAs) Spherical Powder, FeCrNiMoAl High-Entropy Alloys (HEAs) Spherical Powder
CrNiSiMoVAl High-Entropy Alloy (HEA) Spherical Powder is an innovative alloy with unique performance characteristics. The variations in atomic sizes and bonding forces among its elements result in lattice distortion and slow diffusion effects. Studies have demonstrated that this alloy exhibits exceptional mechanical properties, corrosion resistance, wear resistance, magnetic properties, radiation resistance, and low-temperature performance. As a result, it has attracted increasing attention from researchers both domestically and internationally.
CrNiSiMoVAl High-Entropy Alloys (HEAs) Spherical Powder is widely used in aerospace parts and auto parts, profile surface spraying, powder metallurgy, nuclear energy, and industrial fields.
Applicable Process:
-Laser/electron beam additive manufacturing (SLM/EBM)
-Injection molding (MIM)
-Hot isostatic pressing (HIP)
-Powder metallurgy (PM)
-Spraying (SP) and other processes.
Applicable Equipment:
It can be used in all kinds of metal powder 3D printers
-Renishaw
-EOSINT M series
-Concept Laser
-3D system’s laser melting equipment.